Classification Process Examples

Machinery & Equipment

Metals

Copper powder 1

Example of submicron particle extraction

Raw material

d50=2.1μm, d100=18.5μm

Product

d50=0.3μm, d100=1.6μm

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Copper powder 2

Removal of coarse particles from nanoscale materials

Raw material

DBET:152nm

Product

DBET:106nm

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Precious metal powder

Extensive experience in continuous processing has been achieved, even for high-density particles and highly cohesive powders, through proprietary know-how.

Raw material

d50=8.5μm, d100=62.2μm

Product

d50=0.7μm, d100=2.3μm

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Nickel powder

Removal of coarse particles from nanoscale materials

Raw material

DBET:187nm

Product

DBET:167nm

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Soft magnetic powder

Advanced particle size control for metal powders

Raw material

d50=3.1μm, d100=5.0μm

Product

d50=1.9μm, d100=3.0μm

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Solder powder

Product specifications can be flexibly adjusted only through rotational speed control.

Raw material

Product

Particle size range:5–15μm

Particle size range:2–5μm

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Stainless steel powder

Fine powder cut with the Turbo Classifier after coarse powder cut with the Eddy Classifier
Classification at 1 to 100 μm levels of high-density powder results in narrow particle size distribution with high yield by combining EC and TC

Raw material

d10=16.7μm, d50=71.2μm, d90=238.1μm

Intermediate product

d10=6.3μm, d50=14.9μm, d90=25.4μm

Product

d10=11.0μm, d50=17.2μm, d90=27.4μm

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Metal silicon powder

Raw material

DBET:92nm

Product

DBET:75nm

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Ceramics

Silica 1

Raw material

Product

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Silica 2

Example of uniform removal of only particles of 1 μm or smaller

Raw material

1,000x 10.0μm WD: 7.9mm 5kV 2006/09/26 21:52:29 S

Product

1,000x 10.0μm WD: 8.0mm 5kV 2006/09/26 22:01:30 S

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Alumina 1

The structure without a rotor or sieve mesh has provided a solution to the problems of clogging and sieve mesh breakage.

Raw material

d50=6.9μm, d100=74.0μm

Product

d50=6.5μm, d100=31.1μm

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Alumina 2

Raw material

d50=0.5μm, d100=15.6μm

Product

d50=0.4μm, d100=2.3μm Yield85.5%

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Aluminum nitride

Raw material

d50=1.7μm, d100=5.5μm

Product

d50=0.6μm, d100=3.3μm

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Silicon nitride

Raw material

d50=0.7μm, d100=10.0μm

Product

d50=0.6μm, d100=2.3μm

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Barium titanate

Raw material

d50=0.4μm, d100=1.6μm

Product

d50=0.4μm, d100=0.8μm

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Plastics

Acrylic resin 1

Example of cutting +3 to 4 μm in the ppm order not shown in analysis

Raw material

2,000x 5.00μm WD: 9.3mm 5kV 2015/07/23 13:59:05 S

Product

2,000x 5.00μm WD: 8.9mm 5kV 2015/07/23 14:07:58 S

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Acrylic resin 2

High-accuracy classification close to theoretical classification offered for spherical particles. Process indispensable for flat panels.

Raw material

500x 20.0μm WD: 8.0mm 5kV 2006/10/20 19:52:34 S

Product

500x 20.0μm WD: 8.0mm 5kV 2006/10/20 20:23:01 S

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Water-absorbing polymer

Raw material

d10=42.3μm, d50=119.3μm

Product

d10=106.4μm, d50=158.9μm

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Epoxy resin

Raw material

d50=22.1μm, d100=124.5μm

Product

d50=4.3μm, d100=13.1μm

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Food and medical

Matcha powder

Raw material

d50=3.9μm, d100=17.8μm

Product

d50=1.5μm, d100=8.0μm

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Koji powder

Raw material

d50=16.9μm, d100=356.0μm

Product

d50=8.8μm, d100=113.2μm

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Sugar

Raw material

d10=273.2μm, d50=479.6μm

Product

d10=366.3μm, d50=564.0μm

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Other

Calcium carbonate

High-capacity mineral processing with a wide track record

Raw material

d50=1.2μm, d100=7.8μm

Product

d50=0.9μm, d100=3.9μm

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Salt

High-volume processing of up to 1 ton/hour possible for classification around 100 μm where clogging by sieving often occurs

Raw material

d10=67.1μm, d50=234.0μm

Product

d10=153.2μm, d50=263.4μm

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Silica gel

High value-added products having narrow particle size distribution through multiple classification processes

Raw material

d50=4.6μm, d99=11.9μm

Product

d50=4.2μm, d99=6.4μm

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GC abrasive grain

Raw material

d10=0.2μm, d50=0.7μm, d99=19.8μm

Product

d10=0.2μm, d50=0.5μm, d99=4.8μm Yield89.0%

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Glass

Raw material

d50=10.1μm, d99=71.5μm

Product

d50=2.4μm, d99=9.1μm Yield39.7%

Conventional cyclone

d50=2.2μm, d99=8.5μm Yield41.9%

New cyclone

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Carbon

Raw material

d10=0.4μm, d50=11.1μm, d99=58.9μm

Product

d10=0.2μm, d50=0.4μm, d99=3.6μm Yield47.4%

Fine powder

d10=4.5μm, d50=11.3μm, d99=40.3μm

Coarse powder

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